This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:17383/feed
ISSN 2380-4505
High Temperature Conference Papers
Vol. 2023, Issue HiTEC, CICMT, Power, 2023October 17, 2023 EDT

Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules

David Huitink, Whit Vinson, Collin Ruby, Imam Al Razi, David Agogo-Mawuli, Alan Mantooth, Yarui Peng,
Accelerated testingDesign automationDesign for reliabilityInteracting failure mechanismsLayout optimizationPower electronics
https://doi.org/10.4071/001c.89105
IMAPSource Conference Papers
Huitink, David, Whit Vinson, Collin Ruby, Imam Al Razi, David Agogo-Mawuli, Alan Mantooth, and Yarui Peng. 2023. “Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules.” IMAPSource Proceedings 2023 (HiTEC, CICMT, Power): 27–31. https:/​/​doi.org/​10.4071/​001c.89105.

View more stats

Powered by Scholastica, the modern academic journal management system