Vol. 2023, Issue HiTEC, CICMT, Power, 2023October 17, 2023 EDT
Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications
Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications
Lyon, Benjamin, and Christina DiMarino. 2023. “Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications.” IMAPSource Proceedings 2023 (HiTEC, CICMT, Power): 21–26. https://doi.org/10.4071/001c.89104.