Investigations of selected influencing process factors for transient liquid phase soldering (TLPS) as a die-attach method for automotive power modules

Ottinger, Bettina, Joshua Holverscheid, Sebastian König, Annette Brunner, Dr. Lars Müller, Dr. Christian Goth, and Prof. Dr. Jörg Franke. 2023. “Investigations of Selected Influencing Process Factors for Transient Liquid Phase Soldering (TLPS) as a Die-Attach Method for Automotive Power Modules.” IMAPSource Proceedings 2023 (HiTEC, CICMT, Power): 11–15. https://doi.org/10.4071/001c.89095.