Vol. 2023, Issue HiTEC, CICMT, Power, 2023October 17, 2023 EDT
AuSn Preform Thickness’s Effect on Thermal Management in Semiconductor Laser Applications
AuSn Preform Thickness’s Effect on Thermal Management in Semiconductor Laser Applications
Gallery, Jenny, and Samuel Lytwynec. 2023. “AuSn Preform Thickness’s Effect on Thermal Management in Semiconductor Laser Applications.” IMAPSource Proceedings 2023 (HiTEC, CICMT, Power): 5–10. https://doi.org/10.4071/001c.89094.