Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
Digital Twins and Smart Manufacturing for Wire Bonding
Digital Twins and Smart Manufacturing for Wire Bonding
Milton, Basil, Ray Cathcart, Odal Kwon, Pavel Shusharin, and Ivy Qin. 2023. “Digital Twins and Smart Manufacturing for Wire Bonding.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000317–23. https://doi.org/10.4071/001c.74778.