High Robustness of Coated-Ag Wire Bonding

Sarangapani Murali; Lim Yee Weon Evonne; Dhayalan Mariyappan; Lo Miew Wan; Chong Mei Hoe Joanne; Balasubramanian Senthil Kumar; Kang Sungsig SS

doi:10.4071/001c.74776

Murali, Sarangapani, Lim Yee Weon Evonne, Dhayalan Mariyappan, Lo Miew Wan, Chong Mei Hoe Joanne, Balasubramanian Senthil Kumar, and Kang Sungsig SS. 2023. “High Robustness of Coated-Ag Wire Bonding.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000306–10. https://doi.org/10.4071/001c.74776.

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