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Symposium Proceedings
Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT

High Robustness of Coated-Ag Wire Bonding

Sarangapani Murali, Lim Yee Weon Evonne, Dhayalan Mariyappan, Lo Miew Wan, Chong Mei Hoe Joanne, Balasubramanian Senthil Kumar, Kang Sungsig SS,
Coated-Ag bonding wirethermal agingwire bond interfacebonded ballFAB
https://doi.org/10.4071/001c.74776
IMAPSource Conference Papers
Murali, Sarangapani, Lim Yee Weon Evonne, Dhayalan Mariyappan, Lo Miew Wan, Chong Mei Hoe Joanne, Balasubramanian Senthil Kumar, and Kang Sungsig SS. 2023. “High Robustness of Coated-Ag Wire Bonding.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000306–10. https:/​/​doi.org/​10.4071/​001c.74776.
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