Chiplet Integration by Die-to-Die Pillar-Suspended Bridge

Ichiro Kono; Shinji Wakisaka; Toshiaki Hirota; Takashi Saitou; Ken Ukawa; Yoichiro Kurita

doi:10.4071/001c.74775

Kono, Ichiro, Shinji Wakisaka, Toshiaki Hirota, Takashi Saitou, Ken Ukawa, and Yoichiro Kurita. 2023. “Chiplet Integration by Die-to-Die Pillar-Suspended Bridge.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000300–000305. https://doi.org/10.4071/001c.74775.

View more stats

Chiplet Integration by Die-to-Die Pillar-Suspended Bridge

This website uses cookies