Electroplated Aluminum Pillars for Ultrasonic Flip Chip Bonding

S. Braun; I. Cirulis; J.E. Liedtke; K. Hiller; M. Wiemer; H. Kuhn

doi:10.4071/001c.74774

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Braun, S., I. Cirulis, J.E. Liedtke, K. Hiller, M. Wiemer, and H. Kuhn. 2023. “Electroplated Aluminum Pillars for Ultrasonic Flip Chip Bonding.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000294–99. https://doi.org/10.4071/001c.74774.

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