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Symposium Proceedings
Vol. 2022, Issue IMAPS Symposium, 2022
May 01, 2023 EDT
Impact of FCBGA substrate stack-up on BLR performance
Jaimal Williamson
,
Yutaka Suzuki
,
Ron Eller
,
Board level reliability (BLR)
dielectric thickness
Flip chip ball grid array (FCBGA)
substrate
warpage
•
https://doi.org/10.4071/001c.74773
IMAPSource Conference Papers
Williamson, Jaimal, Yutaka Suzuki, and Ron Eller. 2023. “Impact of FCBGA Substrate Stack-up on BLR Performance.”
IMAPSource Proceedings
2022 (IMAPS Symposium): 000287–93.
https://doi.org/10.4071/001c.74773
.
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