Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
Optimization of the Copper Microstructure to Improve Copper-to-Copper Direct Bonding
Optimization of the Copper Microstructure to Improve Copper-to-Copper Direct Bonding
Schmidt, Ralf, Christian Schwarz, Erkin Tamer, and Sascha Dieter. 2023. “Optimization of the Copper Microstructure to Improve Copper-to-Copper Direct Bonding.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000280–86. https://doi.org/10.4071/001c.74772.