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Symposium Proceedings
Vol. 2022, Issue 1, 2022
May 01, 2023 EDT
Optimization of the Copper Microstructure to Improve Copper-to-Copper Direct Bonding
Ralf Schmidt
,
Christian Schwarz
,
Erkin Tamer
,
Sascha Dieter
,
copper-copper direct bonding
copper electrodeposition
hybrid bonding
microstructure
•
https://doi.org/10.4071/001c.74772
IMAPSource Conference Papers
Schmidt, Ralf, Christian Schwarz, Erkin Tamer, and Sascha Dieter. 2023. “Optimization of the Copper Microstructure to Improve Copper-to-Copper Direct Bonding.”
IMAPSource Proceedings
2022 (1): 000280–86.
https://doi.org/10.4071/001c.74772
.
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