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Symposium Proceedings
Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT

Optimization of the Copper Microstructure to Improve Copper-to-Copper Direct Bonding

Ralf Schmidt, Christian Schwarz, Erkin Tamer, Sascha Dieter,
copper-copper direct bondingcopper electrodepositionhybrid bondingmicrostructure
https://doi.org/10.4071/001c.74772
IMAPSource Conference Papers
Schmidt, Ralf, Christian Schwarz, Erkin Tamer, and Sascha Dieter. 2023. “Optimization of the Copper Microstructure to Improve Copper-to-Copper Direct Bonding.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000280–86. https:/​/​doi.org/​10.4071/​001c.74772.
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