Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
Pre-applied underfill Technique for Fine-pitch Cu Pillar 3D Die Stacking to Enable 2.5/3D Advanced Packaging
Pre-applied underfill Technique for Fine-pitch Cu Pillar 3D Die Stacking to Enable 2.5/3D Advanced Packaging
Lay, Nicholas, Nicholas DiNapoli, Kaysar Rahim, PhD., Soheil Razmyar, PhD., and Melissa Holliday. 2023. “Pre-Applied Underfill Technique for Fine-Pitch Cu Pillar 3D Die Stacking to Enable 2.5/3D Advanced Packaging.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000273–79. https://doi.org/10.4071/001c.74770.