Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance Reliability
Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance Reliability
Salunke, Ashish, John Alptekin, Kaushik Akula, Subiksha Jayakumar, Shaurya Kumar, and Oliver Chyan. 2023. “Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance Reliability.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000264–72. https://doi.org/10.4071/001c.74769.