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Symposium Proceedings
Vol. 2022, Issue 1, 2022May 01, 2023 EDT

Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance Reliability

Ashish Salunke, John Alptekin, Kaushik Akula, Subiksha Jayakumar, Shaurya Kumar, Oliver Chyan,
Wafer level package ECM Reliability Passivation Peg Drop Test Metrology
• https://doi.org/10.4071/001c.74769
IMAPSource Conference Papers
Salunke, Ashish, John Alptekin, Kaushik Akula, Subiksha Jayakumar, Shaurya Kumar, and Oliver Chyan. 2023. “Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance Reliability.” IMAPSource Proceedings 2022 (1): 000264–72. https://doi.org/10.4071/001c.74769.
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