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Symposium Proceedings
Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT

Novel Temporary Bonding Film Adapted to Xenon Flash Lamp De-bonding System for FOWLP Application

Hiroaki Matsubara, Tomoaki Shibata, Yuta Akasu, Saeko Ogawa, Ayaka Kuroda, Shogo Sobue,
Temporary bonding filmXenon flash lamp de-bonding systemFan out wafer level package
https://doi.org/10.4071/001c.74751
IMAPSource Conference Papers
Matsubara, Hiroaki, Tomoaki Shibata, Yuta Akasu, Saeko Ogawa, Ayaka Kuroda, and Shogo Sobue. 2023. “Novel Temporary Bonding Film Adapted to Xenon Flash Lamp De-Bonding System for FOWLP Application.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000249–52. https:/​/​doi.org/​10.4071/​001c.74751.
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