ISSN 2380-4505
Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
Development of high performance flip chip ball grid array (FCBGA) packages for automotive application processors
Development of high performance flip chip ball grid array (FCBGA) packages for automotive application processors
Sharma, Gaurav, Nishant Lakhera, Sandeep Shantaram, and Willy Huang. 2023. “Development of High Performance Flip Chip Ball Grid Array (FCBGA) Packages for Automotive Application Processors.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000242–48. https://doi.org/10.4071/001c.74750.