Development of high performance flip chip ball grid array (FCBGA) packages for automotive application processors

Gaurav Sharma; Nishant Lakhera; Sandeep Shantaram; Willy Huang

doi:10.4071/001c.74750

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Sharma, Gaurav, Nishant Lakhera, Sandeep Shantaram, and Willy Huang. 2023. “Development of High Performance Flip Chip Ball Grid Array (FCBGA) Packages for Automotive Application Processors.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000242–48. https://doi.org/10.4071/001c.74750.

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