Development of high performance flip chip ball grid array (FCBGA) packages for automotive application processors

Gaurav Sharma; Nishant Lakhera; Sandeep Shantaram; Willy Huang

doi:10.4071/001c.74750

Sharma, Gaurav, Nishant Lakhera, Sandeep Shantaram, and Willy Huang. 2023. “Development of High Performance Flip Chip Ball Grid Array (FCBGA) Packages for Automotive Application Processors.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000242–48. https://doi.org/10.4071/001c.74750.

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Development of high performance flip chip ball grid array (FCBGA) packages for automotive application processors

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