Die-embedded packaging using Corning® multi-layered glass

Choon-Kon Kim; Yu Xiao; Jong-Min Yook; Hyun-Je Chang; Hyung-Soo Moon

doi:10.4071/001c.74748

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Kim, Choon-Kon, Yu Xiao, Jong-Min Yook, Hyun-Je Chang, and Hyung-Soo Moon. 2023. “Die-Embedded Packaging Using Corning® Multi-Layered Glass.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000230–35. https://doi.org/10.4071/001c.74748.

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