Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
Board Level Reliability of Flipchip Package
Board Level Reliability of Flipchip Package
Lakhera, Nishant, Mollie Benson, and Andrew Mawer. 2023. “Board Level Reliability of Flipchip Package.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000211–16. https://doi.org/10.4071/001c.74741.