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Symposium Proceedings
Vol. 2022, Issue 1, 2022
May 01, 2023 EDT
Interfacial Diffusion Mechanism between ALD Al2O3 passivation/Cu in Direct Bonded Copper Substrate for Power Electronics
Kirak Son
,
Aesun Oh
,
Bongmin Jeong
,
Hyun-Cheol Bae
,
Direct bonded copper substrate
Power electronics
Surface treatment
Shear strength
•
https://doi.org/10.4071/001c.74740
IMAPSource Conference Papers
Son, Kirak, Aesun Oh, Bongmin Jeong, and Hyun-Cheol Bae. 2023. “Interfacial Diffusion Mechanism between ALD Al2O3 Passivation/Cu in Direct Bonded Copper Substrate for Power Electronics.”
IMAPSource Proceedings
2022 (1): 000206–10.
https://doi.org/10.4071/001c.74740
.
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