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Symposium Proceedings
Vol. 2022, Issue 1, 2022May 01, 2023 EDT

Interfacial Diffusion Mechanism between ALD Al2O3 passivation/Cu in Direct Bonded Copper Substrate for Power Electronics

Kirak Son, Aesun Oh, Bongmin Jeong, Hyun-Cheol Bae,
Direct bonded copper substrate Power electronics Surface treatment Shear strength
• https://doi.org/10.4071/001c.74740
IMAPSource Conference Papers
Son, Kirak, Aesun Oh, Bongmin Jeong, and Hyun-Cheol Bae. 2023. “Interfacial Diffusion Mechanism between ALD Al2O3 Passivation/Cu in Direct Bonded Copper Substrate for Power Electronics.” IMAPSource Proceedings 2022 (1): 000206–10. https://doi.org/10.4071/001c.74740.
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