Microstructural Characterization of Sn57Bi1Ag Solder Alloy Joints

Sarangapani Murali; Lim Yee Weon Evonne; Lo Miew Wan; Bayaras Abito Danila; Loke Chee Keong; Lo Yee Ting; Balasubramanian Senthil Kumar; Kang Sungsig SS

doi:10.4071/001c.74735

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Murali, Sarangapani, Lim Yee Weon Evonne, Lo Miew Wan, Bayaras Abito Danila, Loke Chee Keong, Lo Yee Ting, Balasubramanian Senthil Kumar, and Kang Sungsig SS. 2023. “Microstructural Characterization of Sn57Bi1Ag Solder Alloy Joints.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000181–86. https://doi.org/10.4071/001c.74735.

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