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Symposium Proceedings
Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT

Microstructural Characterization of Sn57Bi1Ag Solder Alloy Joints

Sarangapani Murali, Lim Yee Weon Evonne, Lo Miew Wan, Bayaras Abito Danila, Loke Chee Keong, Lo Yee Ting, Balasubramanian Senthil Kumar, Kang Sungsig SS,
SnBiAg solder alloythermal ageingmechanical drop testthermal cycling test
https://doi.org/10.4071/001c.74735
IMAPSource Conference Papers
Murali, Sarangapani, Lim Yee Weon Evonne, Lo Miew Wan, Bayaras Abito Danila, Loke Chee Keong, Lo Yee Ting, Balasubramanian Senthil Kumar, and Kang Sungsig SS. 2023. “Microstructural Characterization of Sn57Bi1Ag Solder Alloy Joints.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000181–86. https:/​/​doi.org/​10.4071/​001c.74735.
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