Simulation and Experimental Study on Edge Bonding Shape for Reliable BGA Packages

Yasuhiko Kato; Hiroyuki Hamagami; Tomoaki Shibata; Kohei Seki; Ryota Sato

doi:10.4071/001c.74729

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Kato, Yasuhiko, Hiroyuki Hamagami, Tomoaki Shibata, Kohei Seki, and Ryota Sato. 2023. “Simulation and Experimental Study on Edge Bonding Shape for Reliable BGA Packages.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000173–76. https://doi.org/10.4071/001c.74729.

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