Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
A Physics-of-Failure Investigation of Flip Chip Reliability Based on Lead-Free Solder Fatigue Modeling
A Physics-of-Failure Investigation of Flip Chip Reliability Based on Lead-Free Solder Fatigue Modeling
Brinlee, Sean, and Scott Popelar, Ph.D. 2023. “A Physics-of-Failure Investigation of Flip Chip Reliability Based on Lead-Free Solder Fatigue Modeling.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000166–72. https://doi.org/10.4071/001c.74728.