Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
Development of all new structure of Dicing Die Attach Film (DDAF) for Stealth Dicing and Cool Expansion processes
Development of all new structure of Dicing Die Attach Film (DDAF) for Stealth Dicing and Cool Expansion processes
Iwaya, Wataru, Yosuke Sato, Misaki Sakamoto, Masanori Yamagishi, and Naoya Saiki. 2023. “Development of All New Structure of Dicing Die Attach Film (DDAF) for Stealth Dicing and Cool Expansion Processes.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000151–54. https://doi.org/10.4071/001c.74636.