Assembly Technology for FO-MCM with HBM in HPC Application

Liu, Shuai-Lin, Nicholas Kao, Vito Lin, Teny Shih, and Yu-Po Wang. 2023. “Assembly Technology for FO-MCM with HBM in HPC Application.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000141–44. https:/​/​doi.org/​10.4071/​001c.74633.