Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
Advancements, Versatility, and Flexibility of Dual-Layer Material System for Advanced Packaging Applications
Advancements, Versatility, and Flexibility of Dual-Layer Material System for Advanced Packaging Applications
Jones, Andy, Dongshun Bai, Matt Koch, and Luke Prenger. 2023. “Advancements, Versatility, and Flexibility of Dual-Layer Material System for Advanced Packaging Applications.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000127–35. https://doi.org/10.4071/001c.74630.