Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:43675/feed
Symposium Proceedings
Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT

A Drop-in High-Temperature Pb-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications

Hongwen Zhang, Tyler Richmond, Samuel Lytwynec, Tybarius Harter, Diego Prado,
lead-free solderpower discretetemperature cyclingdie-attachDurafuseTM
https://doi.org/10.4071/001c.74628
IMAPSource Conference Papers
Zhang, Hongwen, Tyler Richmond, Samuel Lytwynec, Tybarius Harter, and Diego Prado. 2023. “A Drop-in High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete Applications.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000116–20. https:/​/​doi.org/​10.4071/​001c.74628.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system