Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
A Drop-in High-Temperature Pb-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications
A Drop-in High-Temperature Pb-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications
Zhang, Hongwen, Tyler Richmond, Samuel Lytwynec, Tybarius Harter, and Diego Prado. 2023. “A Drop-in High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete Applications.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000116–20. https://doi.org/10.4071/001c.74628.
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