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IMAPS Chapter Conferences
Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT

Novel Electroformed Ni-Au Alloy for High Temperature Semiconductor Test Structures

Robert D. Hilty, Evgeniya Freydina,
ElectroformingMaterialsPlatingTest Probes
https://doi.org/10.4071/001c.74615
IMAPSource Conference Papers
Hilty, Robert D., and Evgeniya Freydina. 2023. “Novel Electroformed Ni-Au Alloy for High Temperature Semiconductor Test Structures.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000085–000088. https:/​/​doi.org/​10.4071/​001c.74615.
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