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IMAPS Chapter Conferences
Vol. 2022, Issue 1, 2022
May 01, 2023 EDT
Novel Electroformed Ni-Au Alloy for High Temperature Semiconductor Test Structures
Robert D. Hilty
,
Evgeniya Freydina
,
Electroforming
Materials
Plating
Test Probes
•
https://doi.org/10.4071/001c.74615
IMAPSource Conference Papers
Hilty, Robert D., and Evgeniya Freydina. 2023. “Novel Electroformed Ni-Au Alloy for High Temperature Semiconductor Test Structures.”
IMAPSource Proceedings
2022 (1): 000085–000088.
https://doi.org/10.4071/001c.74615
.
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