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IMAPS Chapter Conferences
Vol. 2022, Issue 1, 2022May 01, 2023 EDT

Novel Electroformed Ni-Au Alloy for High Temperature Semiconductor Test Structures

Robert D. Hilty, Evgeniya Freydina,
Electroforming Materials Plating Test Probes
• https://doi.org/10.4071/001c.74615
IMAPSource Conference Papers
Hilty, Robert D., and Evgeniya Freydina. 2023. “Novel Electroformed Ni-Au Alloy for High Temperature Semiconductor Test Structures.” IMAPSource Proceedings 2022 (1): 000085–000088. https://doi.org/10.4071/001c.74615.
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