Advancing Reliable High-Temperature Electronics through Compatible Material Interfaces

J. Kupernik; M. Bakowski; N. Chiolino; M. Barlow; B. Dyer; A. M. Francis

doi:10.4071/001c.74611

Loading [Contrib]/a11y/accessibility-menu.js

Kupernik, J., M. Bakowski, N. Chiolino, M. Barlow, B. Dyer, and A. M. Francis. 2023. “Advancing Reliable High-Temperature Electronics through Compatible Material Interfaces.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000076–000080. https://doi.org/10.4071/001c.74611.

View more stats