A Novel Lead-Free Low-Temperature Solder Paste for Wafer-Level Package Application

Hongwen Zhang; Tyler Richmond; Tybarius Harter; Diego Prado; Jie Geng; Huaguang Wang

doi:10.4071/001c.74609

Zhang, Hongwen, Tyler Richmond, Tybarius Harter, Diego Prado, Jie Geng, and Huaguang Wang. 2023. “A Novel Lead-Free Low-Temperature Solder Paste for Wafer-Level Package Application.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000068–000075. https://doi.org/10.4071/001c.74609.

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