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Symposium Proceedings
Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT

Electrically Insulative Film Adhesive with Enhanced Thermal Performance to Assemble High Power Density Electronic Devices

Yuan Zhao, Bruno Tolla, Doug Katze, John Wood, Ana Pre, Junbo Gao,
RF power devicesthermal managementelectronics packagingadhesivespower modulesRF grounding
https://doi.org/10.4071/001c.74608
IMAPSource Conference Papers
Zhao, Yuan, Bruno Tolla, Doug Katze, John Wood, Ana Pre, and Junbo Gao. 2023. “Electrically Insulative Film Adhesive with Enhanced Thermal Performance to Assemble High Power Density Electronic Devices.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000062–000067. https:/​/​doi.org/​10.4071/​001c.74608.
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