Vol. 2022, Issue 1, 2022May 01, 2023 EDT
Electrically Insulative Film Adhesive with Enhanced Thermal Performance to Assemble High Power Density Electronic Devices
Electrically Insulative Film Adhesive with Enhanced Thermal Performance to Assemble High Power Density Electronic Devices
Zhao, Yuan, Bruno Tolla, Doug Katze, John Wood, Ana Pre, and Junbo Gao. 2023. “Electrically Insulative Film Adhesive with Enhanced Thermal Performance to Assemble High Power Density Electronic Devices.” IMAPSource Proceedings 2022 (1): 000062–000067. https://doi.org/10.4071/001c.74608.
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