Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
FEA Assisted Optimization of Bump Shear Test Method for Assessment of Back-End-of-Line Mechanical Integrity
FEA Assisted Optimization of Bump Shear Test Method for Assessment of Back-End-of-Line Mechanical Integrity
Lee, Moon Soo, Min Kim, Sungwon Jung, A-ram Kang, Myeong-soo Yeo, Shinyoung Chung, and Eun-cheol Lee. 2023. “FEA Assisted Optimization of Bump Shear Test Method for Assessment of Back-End-of-Line Mechanical Integrity.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000023–000031. https://doi.org/10.4071/001c.74599.