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Symposium Proceedings
Vol. 2022, Issue 1, 2022
May 01, 2023 EDT
Assembly Solutions for Cost-Effective Heterogeneous Integration with Disparate Die Types
Glenn Farris
,
Advanced Packaging
Heterogeneous Integration
2.5D Assembly
Fan-Out
•
https://doi.org/10.4071/001c.74597
IMAPSource Conference Papers
Farris, Glenn. 2023. “Assembly Solutions for Cost-Effective Heterogeneous Integration with Disparate Die Types.”
IMAPSource Proceedings
2022 (1): 000018–000022.
https://doi.org/10.4071/001c.74597
.
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