Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
Assembly Solutions for Cost-Effective Heterogeneous Integration with Disparate Die Types
Assembly Solutions for Cost-Effective Heterogeneous Integration with Disparate Die Types
Farris, Glenn. 2023. “Assembly Solutions for Cost-Effective Heterogeneous Integration with Disparate Die Types.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000018–000022. https://doi.org/10.4071/001c.74597.