Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Use advanced search instead (articles only)
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2022, Issue IMAPS Symposium, 2022
May 01, 2023 EDT
An Organic Package Designer’s Guide to Transitioning to FOWLP and 2.5D Design
Bill Acito
,
EDA
design
2.5D
3D
IC Packaging
Chiplet
Interposer
•
https://doi.org/10.4071/001c.74595
IMAPSource Conference Papers
Acito, Bill. 2023. “An Organic Package Designer’s Guide to Transitioning to FOWLP and 2.5D Design.”
IMAPSource Proceedings
2022 (IMAPS Symposium): 000005–000009.
https://doi.org/10.4071/001c.74595
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats