Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:40836/feed
Symposium Proceedings
Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT

An Organic Package Designer’s Guide to Transitioning to FOWLP and 2.5D Design

Bill Acito,
EDAdesign2.5D3DIC PackagingChipletInterposer
https://doi.org/10.4071/001c.74595
IMAPSource Conference Papers
Acito, Bill. 2023. “An Organic Package Designer’s Guide to Transitioning to FOWLP and 2.5D Design.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000005–000009. https:/​/​doi.org/​10.4071/​001c.74595.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system