Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
Study for Bonding Technology by Electroplated Nano porous Cu Structure
Study for Bonding Technology by Electroplated Nano porous Cu Structure
Furuyama, Daiki, Takuma Nakagawa, Junta Inoue, Koji Tatsumi, Sho Nakagawa, and Takuma Katase. 2023. “Study for Bonding Technology by Electroplated Nano Porous Cu Structure.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000442–47. https://doi.org/10.4071/001c.74592.