Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
A Hybrid Pressure-less Silver Sintering Technology for High-power Density Electronics
A Hybrid Pressure-less Silver Sintering Technology for High-power Density Electronics
Zhao, Yuan, Bruno Tolla, Doug Katze, Glenda Castaneda, John Wood, Jo-Anne Wilson, and David Brand. 2023. “A Hybrid Pressure-Less Silver Sintering Technology for High-Power Density Electronics.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000436–41. https://doi.org/10.4071/001c.74591.