Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
Heterogeneous Integration Hybrid Substrate with Ajinomoto Build-Up Film
Heterogeneous Integration Hybrid Substrate with Ajinomoto Build-Up Film
Channing Cheng-Lin Yang, John H Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Andy Peng, Hsing-Ning Liu, YH Chen, Tzyy-Jang Tseng,
Yang, Channing Cheng-Lin, John H Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Andy Peng, Hsing-Ning Liu, YH Chen, and Tzyy-Jang Tseng. 2023. “Heterogeneous Integration Hybrid Substrate with Ajinomoto Build-Up Film.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000428–35. https://doi.org/10.4071/001c.74589.