Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
Thermal Performance of Liquid Metal Pastes Containing low Content of Metal Particles for Thermal Interface Materials in IC Module Electronics
Thermal Performance of Liquid Metal Pastes Containing low Content of Metal Particles for Thermal Interface Materials in IC Module Electronics
Fan, Guangyu, Jeff Kurish, Sofia Tagliaferri, Kyle Green, and Christine LaBarbera. 2023. “Thermal Performance of Liquid Metal Pastes Containing Low Content of Metal Particles for Thermal Interface Materials in IC Module Electronics.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000389–95. https://doi.org/10.4071/001c.74583.