Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
Study on CPI behaviors of X Dimension Fan-Out Integration (XDFOI) packages
Study on CPI behaviors of X Dimension Fan-Out Integration (XDFOI) packages
Chen, Haijie, Zhen Hu, Chen Wang, Ming He, Jielei Xie, Yaojian Lin, and Choon Heung Lee. 2023. “Study on CPI Behaviors of X Dimension Fan-Out Integration (XDFOI) Packages.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000382–88. https://doi.org/10.4071/001c.74581.