Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
Innovations in Soldering Materials and Optimization of Solder Paste Printing and Inspection Parameters for System-in-Package Assembly
Innovations in Soldering Materials and Optimization of Solder Paste Printing and Inspection Parameters for System-in-Package Assembly
Griffith, Evan, Casey Rowland, David Sbiroli, and Jonas Sjoberg. 2023. “Innovations in Soldering Materials and Optimization of Solder Paste Printing and Inspection Parameters for System-in-Package Assembly.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000338–44. https://doi.org/10.4071/001c.74547.