Additive Packaging for Bare Die and Additively Integrated Antenna

Christopher Areias; Emily Lamport; Yuri Piro; Michael Cason; Craig Armiento; Alkim Akyurtlu

doi:10.4071/001c.74545

Areias, Christopher, Emily Lamport, Yuri Piro, Michael Cason, Craig Armiento, and Alkim Akyurtlu. 2023. “Additive Packaging for Bare Die and Additively Integrated Antenna.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000333–37. https://doi.org/10.4071/001c.74545.

View more stats