Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2022, Issue 1, 2022May 01, 2023 EDT

The Study of Highest Thickness Photo Resist for Cu Post of Fan-Out Wafer Level Packaging

Yuseon Heo, Jiyoung Lee, Jieun Park, Junhyeong Park, Jihye Shim, Sueryeon Kim,
Fan-out packaging thick thickness photoresist Cu post
• https://doi.org/10.4071/001c.74539
IMAPSource Conference Papers
Heo, Yuseon, Jiyoung Lee, Jieun Park, Junhyeong Park, Jihye Shim, and Sueryeon Kim. 2023. “The Study of Highest Thickness Photo Resist for Cu Post of Fan-Out Wafer Level Packaging.” IMAPSource Proceedings 2022 (1): 000498–000501. https://doi.org/10.4071/001c.74539.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system