Vol. 2022, Issue IMAPS Symposium, 2022May 01, 2023 EDT
Open-Cavity Plastic Packages: A Robust IC Packaging Solution for High-Reliability Applications
Open-Cavity Plastic Packages: A Robust IC Packaging Solution for High-Reliability Applications
Sadri, Sam, and Tom Tammen. 2023. “Open-Cavity Plastic Packages: A Robust IC Packaging Solution for High-Reliability Applications.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000454–57. https://doi.org/10.4071/001c.74536.