Open-Cavity Plastic Packages: A Robust IC Packaging Solution for High-Reliability Applications

Sam Sadri; Tom Tammen

doi:10.4071/001c.74536

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Sadri, Sam, and Tom Tammen. 2023. “Open-Cavity Plastic Packages: A Robust IC Packaging Solution for High-Reliability Applications.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000454–57. https://doi.org/10.4071/001c.74536.

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