Board-Level Reliability of Lead-Frame Based Substrate and Surface  Finishing Technology

I.S. Bae; Hong Chan Kim; Sung-Il Kang; Se Chuel Park; Larry Marcanti; John Marke; Richard Coyle; Joe Smetana

doi:10.4071/001c.74533

Bae, I.S., Hong Chan Kim, Sung-Il Kang, Se Chuel Park, Larry Marcanti, John Marke, Richard Coyle, and Joe Smetana. 2023. “Board-Level Reliability of Lead-Frame Based Substrate and Surface Finishing Technology.” IMAPSource Proceedings 2022 (IMAPS Symposium): 000493–97. https://doi.org/10.4071/001c.74533.

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Board-Level Reliability of Lead-Frame Based Substrate and Surface Finishing Technology

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