Vol. 2021, Issue HiTEC, CICMT, Power, 2021April 01, 2021 EDT
Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging
Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging
Matthias Hunstig, Sebastian Holtkämper, Lars Helmich, Michael Brökelmann,
Hunstig, Matthias, Sebastian Holtkämper, Lars Helmich, and Michael Brökelmann. 2021. “Smart Ultrasonic Welding – A Versatile Interconnection Technology for Power Electronics Packaging.” IMAPSource Proceedings 2021 (HiTEC, CICMT, Power): 112–17. https://doi.org/10.4071/2380-4491.2021.HiTEC.000112.