ISSN 2380-4505
Vol. 2021, Issue HiTEC, CICMT, Power, 2021April 01, 2021 EDT
470 Celsius Packaging System for Silicon Carbide Electronics
470 Celsius Packaging System for Silicon Carbide Electronics
N. Chiolino, A. M. Francis, J. Holmes, M. Barlow, C. Perkowski,
Chiolino, N., A. M. Francis, J. Holmes, M. Barlow, and C. Perkowski. 2021. “470 Celsius Packaging System for Silicon Carbide Electronics.” IMAPSource Proceedings 2021 (HiTEC, CICMT, Power): 83–88. https://doi.org/10.4071/2380-4491.2021.HiTEC.000083.