ISSN 2380-4505
Vol. 2021, Issue HiTEC, CICMT, Power, 2021April 01, 2021 EDT
A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits
A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits
Liangyu Chen, Philip G. Neudeck, David J. Spry, Glenn M. Beheim, Gary W. Hunter,
Chen, Liangyu, Philip G. Neudeck, David J. Spry, Glenn M. Beheim, and Gary W. Hunter. 2021. “A 96% Alumina Based Packaging System for 500°C Test of SiC Integrated Circuits.” IMAPSource Proceedings 2021 (HiTEC, CICMT, Power): 69–75. https://doi.org/10.4071/2380-4491.2021.HiTEC.000069.