A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits

Liangyu Chen; Philip G. Neudeck; David J. Spry; Glenn M. Beheim; Gary W. Hunter

doi:10.4071/2380-4491.2021.HiTEC.000069

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Chen, Liangyu, Philip G. Neudeck, David J. Spry, Glenn M. Beheim, and Gary W. Hunter. 2021. “A 96% Alumina Based Packaging System for 500°C Test of SiC Integrated Circuits.” IMAPSource Proceedings 2021 (HiTEC, CICMT, Power): 69–75. https://doi.org/10.4071/2380-4491.2021.HiTEC.000069.

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