Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
General
Vol. 2021, Issue HiTEC, CICMT, Power, 2021April 01, 2021 EDT

Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature

Daniel Tyler, Svetlana Lukich, Raul DePersia, Chase Guilbeau, Mark Carter,
metalized polyetherimide PEI film capacitors high temperature
• https://doi.org/10.4071/2380-4491.2021.HiTEC.000031
IMAPSource Conference Papers
Tyler, Daniel, Svetlana Lukich, Raul DePersia, Chase Guilbeau, and Mark Carter. 2021. “Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature.” IMAPSource Proceedings 2021 (HiTEC, CICMT, Power): 31–40. https://doi.org/10.4071/2380-4491.2021.HiTEC.000031.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system