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Vol. 2021, Issue HiTEC, CICMT, Power, 2021April 01, 2021 EDT

Package Design and Analysis for Vertical Gallium Nitride Field Effect Transistors

John Harris, David Huitink, Dan Ewing,
Fusing Gallium Nitride Logic Packaging
• https://doi.org/10.4071/2380-4491.2021.HiTEC.000058
IMAPSource Conference Papers
Harris, John, David Huitink, and Dan Ewing. 2021. “Package Design and Analysis for Vertical Gallium Nitride Field Effect Transistors.” IMAPSource Proceedings 2021 (HiTEC, CICMT, Power): 58–63. https://doi.org/10.4071/2380-4491.2021.HiTEC.000058.
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