ISSN 2380-4505
Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
A Novel Design of High-Temperature Lead-Free Solders for Die-Attachment in Power Discrete Applications
A Novel Design of High-Temperature Lead-Free Solders for Die-Attachment in Power Discrete Applications
Hongwen Zhang, Samuel Lytwynec, Huaguang Wang, Jie Geng, Francis Mutuku, Ning-Cheng Lee,
Zhang, Hongwen, Samuel Lytwynec, Huaguang Wang, Jie Geng, Francis Mutuku, and Ning-Cheng Lee. 2021. “A Novel Design of High-Temperature Lead-Free Solders for Die-Attachment in Power Discrete Applications.” IMAPSource Proceedings 2021 (IMAPS Symposium): 356–61. https://doi.org/10.4071/1085-8024-2021.1.000356.