Vol. 2021, Issue 1, 2021October 01, 2021 EDT
A Novel Design of High-Temperature Lead-Free Solders for Die-Attachment in Power Discrete Applications
A Novel Design of High-Temperature Lead-Free Solders for Die-Attachment in Power Discrete Applications
Zhang, Hongwen, Samuel Lytwynec, Huaguang Wang, Jie Geng, Francis Mutuku, and Ning-Cheng Lee. 2021. “A Novel Design of High-Temperature Lead-Free Solders for Die-Attachment in Power Discrete Applications.” IMAPSource Proceedings 2021 (1): 356–61. https://doi.org/10.4071/1085-8024-2021.1.000356.
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