Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
General
Vol. 2021, Issue 1, 2021October 01, 2021 EDT

Thermal and Reliability Performance Comparison of DBC-Based and Organic-Based Double-Sided Cooled Power Modules

Tzu-Hsuan Cheng, Kenji Nishiguchi, Yoshi Fukawa, Douglas C. Hopkins,
Double-sided cooling epoxy-resin composite dielectric half-bridge power module power electronic packaging thermal modeling thermal-mechanical modeling
• https://doi.org/10.4071/1085-8024-2021.1.000382
IMAPSource Conference Papers
Cheng, Tzu-Hsuan, Kenji Nishiguchi, Yoshi Fukawa, and Douglas C. Hopkins. 2021. “Thermal and Reliability Performance Comparison of DBC-Based and Organic-Based Double-Sided Cooled Power Modules.” IMAPSource Proceedings 2021 (1): 382–89. https://doi.org/10.4071/1085-8024-2021.1.000382.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system