Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Advanced bonding interface inspection technique for process optimization in heavy wire bonding
Advanced bonding interface inspection technique for process optimization in heavy wire bonding
Stefan Schmitz, Noritoshi Araki, Motoki Eto, Tadashi Yamaguchi, Teruo Haibara, Takashi Yamada,
Schmitz, Stefan, Noritoshi Araki, Motoki Eto, Tadashi Yamaguchi, Teruo Haibara, and Takashi Yamada. 2021. “Advanced Bonding Interface Inspection Technique for Process Optimization in Heavy Wire Bonding.” IMAPSource Proceedings 2021 (IMAPS Symposium): 332–38. https://doi.org/10.4071/1085-8024-2021.1.000332.