Vol. 2021, Issue IMAPS Symposium, 2021October 01, 2021 EDT
Experimental parameter identification and validation of a process model for ultrasonic heavy wire bonding
Experimental parameter identification and validation of a process model for ultrasonic heavy wire bonding
Reinhard Schemmel, Nico Müller, Ludger Klahold, Tobias Hemsel, Walter Sextro,
Schemmel, Reinhard, Nico Müller, Ludger Klahold, Tobias Hemsel, and Walter Sextro. 2021. “Experimental Parameter Identification and Validation of a Process Model for Ultrasonic Heavy Wire Bonding.” IMAPSource Proceedings 2021 (IMAPS Symposium): 346–55. https://doi.org/10.4071/1085-8024-2021.1.000346.